News and Events
Paper Submission Deadline January 8, 2025 (11:59 PM CST)
Student poster Competition Submission Deadline January 8, 2025 (11:59 PM CST)
Special Session Proposal Submission Deadline January 22, 2025 (11:59 PM CST)
Notification of Acceptance February 5, 2025
Final Paper Submission February 28, 2025

The 18th IEEE Dallas Circuits and Systems conference will be held at the University of Texas at Arlington from April 11, 2025 to April 13, 2025. This conference is co-sponsored by the IEEE Circuits and Systems (CAS) Society, the IEEE Solid-State Circuits Society, the IEEE Electron Devices Society, UT Dallas and UNT and will feature a comprehensive program of technical papers, poster sessions and keynote speakers. This year’s meeting contributions will focus on all areas of circuits, systems and data processing, including but not limited to the following:

  • VLSI design and methodologies
  • Analog and RF mixed signal design and ICs
  • Synthesis, DFT and Verification Methodologies
  • Design for Manufacturability and Yield
  • Hardware-Software Co-Design
  • Device-Circuit Co-Design
  • Power Systems and Power Electronics
  • Computer Aided Design
  • Low-Power Design
  • Temperature-Aware Design
  • Devices and Modeling
  • Communications
  • Nanoscale Computing and Nano-Electronics
  • High Performance Computing
  • Quantum Computing and Spintronics
  • Multi-core and Parallel Architectures
  • Networks-on-chip
  • Embedded Systems
  • Sensors and Sensor Arrays
  • Signals and Systems
  • Reconfigurable Systems
  • Education in Circuits and Systems
  • Internet of Things
  • Cyber-Physical Systems
  • Artificial Intelligence Circuits and Architectures
  • Hardware Security
  • Emerging Technologies
  • Big Data Processing
  • Compressive Sensing
  • Cognitive Computing and Deep Learning
  • Smart Systems for Automotive
  • Personalized Healthcare Systems
  • Sustainable Computing and Systems
  • Innovative Neurotechnologies
  • Energy-Aware Systems and Services
  • Power Management, Energy Harvesting, and Wireless Power
  • 5G and Multi-Gigabit Optoelectronics Comm
  • Audio and Video Processing
  • Packaging